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LUNOVO (Lunovo Technology Limited)

Hong Kong skyline — LUNOVO Technology Limited

LUNOVO (Lunovo Technology Limited) is a Hong Kong-based technology company specializing in the research, product development, and industrial application of phase change materials (PCMs), phase change energy storage, and intelligent thermal management technologies. The company primarily serves sectors such as power batteries, energy storage systems, AI data centers, precision instruments, electronic devices, and industrial thermal management. LUNOVO provides integrated technical solutions ranging from phase change materials and encapsulated products to thermal management system design, testing, and validation.

The company has established a comprehensive product portfolio centered on phase change energy storage and thermal management technologies, including:

These products cover a wide range of temperature intervals and can be customized in terms of phase change temperature, thermal storage performance, thermal conductivity, material concentration, and encapsulation form according to specific operating conditions.

Organic and inorganic PCMs achieve typical latent heat values exceeding 200 J/g, with some products demonstrating cycling stability of over 5,000 cycles. HPCM products offer thermal conductivity ranging from 1.5 to 20 W/(m·K), meeting the demands of high-heat-flux and fast-thermal-response scenarios.

LUNOVO not only offers standardized PCM products but also provides material selection, encapsulation design, thermal management scheme development, and performance validation tailored to specific application scenarios. For power batteries and energy storage systems, the company integrates PCM, PCE, HPCM with liquid cooling, air cooling, and heating technologies to build thermal management solutions for cooling, thermal insulation, and low-temperature preheating.

Encapsulation forms include HDPE, composite aluminum foil pouches, and aluminum alloy structures, which can be flexibly selected based on equipment structure, installation space, heat transfer requirements, and application environments.